Arvind Krishna

29 Rustic Gate Lane  ¨  Dix Hills, NY 11746  ¨  631-935-3365  ¨  akrishna@theakconsulting.com

VP of R&D | Engineering Director | CTO | Technical Director

Accomplished Technology Executive with contributions in Automotive Electronics, Solar Energy (Inverters, Storage), Industrial Equipment (Thermal Spray) and Rigid Plastic Conversion for innovative and world-leading companies (Delphi, GM, Enphase, Oerlikon, Graham Packaging). Experienced leader of global product development and engineering teams, skilled in launching complex electromechanical innovations into the market at low cost, high quality and reliability using high-volume manufacturing processes and products.

Core Competencies & Key Professional Strengths

R&D Leadership                                                   Product Development                                         Automotive Electronics

Electronics Packaging                                          Alternative Energy (Solar)                                 Multi-Disciplinary Engineering

Product Lifecycle Management                          Modeling and Simulation                                   Project and Resource Planning

Global Footprint                                                     System Level Thermal Management               Solid Mechanics

Innovation and IP                                                  Finite Element Analysis (CAE)                          People Development and Mentoring

Design for Reliability and Quality                        Vibration and Dynamics                                     Multiphysics and Mathematics

EDUCATION

The Ohio State University                                                  Ph.D., Mechanical Engineering

The Ohio State University                                                  M.S., Mechanical Engineering

Indian Institute of Technology, Madras                            Bachelor of Technology, Mechanical Engineering

(top-rated engineering institute in India, with 1% acceptance rate)

HIGHLIGHTS AND MAJOR ACCOMPLISHMENTS

¨       Accelerated the development of Thermal Spray Equipment (controllers, guns, powder feeders) at Oerlikon using Additive Manufacturing (3D printed functional parts) and software partnerships, leveraging Swiss and US multi-disciplinary (electro-pneumatics, mechanical, controls PLC & HMI software, industrial design) engineering team.

• Developed and launched next generation of Solar Microinverters at Enphase Energy with a new silicone potting compound technology for low cost, high reliability and high volume manufacturability, using an international team (New Zealand, US, China).

• Winner of the inaugural Mentoring Award for international talent development. Pioneered the expansion of global engineering footprint of Delphi into hardware activityin Asia.

• Developed 30+ sophisticated and novel design tools with unique combination of theoretical physics modeling, software code (Javascript, HTML, Matlab, Excel) and experimental verification. Used extensively as Best Practices by the engineering community for rapid product PASS/FAIL recommendations and incorporated into Product Development process at Delphi.

• Author of 35+ global conference, 6 journal publications (ASME, SAE, IEEE) and 3 Trade Secrets in Thermal Management, Electronics Packaging Reliability, Vibration Durability, Random Vibration Fatigue and Fracture Mechanics.

Publication List (click on text)

GRAHAM PACKAGING (York, Pennsylvania)

Director of Engineering and Process Development                                                  2019 – 2020

• Drove innovations in plastic weight minimization, sustainability and new markets – glass to plastic conversion, aerosol packages from aluminum to PET. Improved process reliability and innovation in PET manufacturing (stretch blow molding) for plastic containers with targeted advances in simulation (ANSYS) and data analytics for product and process performance (Tableau, OSI PI).
• Created new modeling tools for container product performance in Hot Fill Vacuum, Top Load and Creep-Based Deformation, using novel approaches in physics and polymer mechanics.

• Rapidly raised technical capability within department with experimental and computational advancements including Digital Image Correlation and high strain-rate biaxial material characterization, adding in-house expertise along with strategic partnerships (Deloitte, Trilion, BMT, PTI, Johns Hopkins University).

OERLIKON (Westbury, New York)

Global Director of Engineering, R&D and Product Development                          2015-2018

• Led the rejuvenation of Thermal Spray Equipment product portfolio with market launches of 4 new products across a range of processes (Plasma, HVOF, Combustion) to help maintain and grow Oerlikon’s market lead and IIoT (Industry4.0) readiness.

• Improved key metric (KPI) for revenue from new products to 20% of total, showing vitality and market-acceptance of products.

• Collaborated with Digital partners (Rockwell Automation, Siemens), academia and in-house talent to merge sensing, analytics, machine learning (AI) and cloud communication for predictive maintenance of wear parts.

• Introduced and instilled automotive engineering processes (Peer Reviews, Validation, DFMEAs) to improve quality and reliability during Phase Gate execution. Improved Software revision control and launch of Minimum Viable Products.

• Member of Oerlikon Metco (US) Executive Committee and Global R&D Council, with $10M budget. Grew research relationships with Hofstra, SUNY Stony Brook, Commonwealth Center for Advanced Manufacturing (CCAM) and Concordia University.

ENPHASE ENERGY (Petaluma, California)

Director of Mechanical Engineering and Engineering Services                            2013-2015

• Executive Lead ownership and accountability for product innovations: New potting compound in solar microinverters, Storage architecture combining battery and inverter, high-functionality metering and diagnostics.

• Demonstrated 30% BOM cost reduction in microinverter with a more compact enclosure and PCB design.

• Rebuilt technical foundation of Mechanical Engineering with hiring of deep-skilled contributors and collaborative product development with Operations, Product Validation and CTO.

DELPHI AUTOMOTIVE SYSTEMS (Kokomo, Indiana)

Global Manager, Mechanical Design and Analysis                         DELPHI           2011-2013

PRODUCT PORTFOLIO   Electronics & Safety – Camera & Radar-Based Sensors      Powertrain – Engine Control Modules          Infotainment – CDs, Telematics, Satellite Radio    Power Electronics – Battery Packs, Chargers  

• Directed mechanical engineering staff of 40 (US, Europe, Asia) in simulation, design verification and reliability for Product Development in all business units, enabling Delphi to expand geographic market span with strong regional technical competencies.

• Responsible for budgets, hardware for engineering analysis and testing, simulation software, analysis execution and customer engagement for Electronics & Safety division at critical design and testing approval phases.

Senior Staff Engineer                                     DELPHI & GENERAL MOTORS         1995-2011

• Led proof-of-concept developments in Power Electronics (Battery Packs, Inverters, Chargers) – Isolation techniques for harsh vibration and shock; Mitigating pumpout of Thermal Interface Materials; Fatigue endurance demonstration for IGBT packages.
• Infused new simulation and testing technology into Hardware Engineering (Laser Vibrometer, Transient Thermal Tester) to keep division at cutting edge.

• Initiator and owner of Advanced Research & Technology Projects such as

• Low-cost piezoelectric fans for thermal management of low-to-moderate heat applications (research with Purdue University).
  • Quantification of the effect of imposed pressure combined with temperature cycling on solder joint reliability for leaded parts.
  • Vibration-induced fatigue of electronic packages (BGAs, Flip Chips, Leaded SMT, Electrolytic Capacitors).

• Led the usage of FEA techniques (ANSYS, ABAQUS) in automotive electronics applications. Introduced system level thermal tool FLOTHERM as a vital aspect of part verification for Audio Systems.

• Propelled challenging disciplines of random vibration fatigue failure prediction and system level thermal management of electronics into mainstream activities to prevent product failures and meet demanding customer specifications. Revolutionized a reactive, post-failure analytical culture to an up-front prevention-oriented organization.

• Improved designs and reliability performance of radio products (sheet metal mounting brackets, plastic trimplates, lightpipes) with software tools MOLDFLOW for injection molding  and ASAP ray tracing for optics backlighting.  

Engineering Intern                                         BATTELLE          Columbus, OH        1994-1995

• Generated Nuclear Regulatory Commission guidelines for limit loads on elbow (bent) pipes using fracture mechanics.  

Research Associate             THE OHIO STATE UNIVERSITY Columbus, OH       1989-1995

• Developed technical foundation for time-dependent behavior (creep and relaxation) of polymer thin films to prevent delamination in electronics packaging. Sought and obtained Semiconductor Research Consortium funding for research.

• Tracked the distribution of proppants, used by the oil industry in hydraulic fractures to prop open ground fissures (fracking), using a newly developed analytical technique for the mechanics of solid particle flows in liquids.